Silicon photonics
Transceivers and Switches
Way ahead of the curve
There is an ever-growing demand for high-speed data transfer in datacom and telecom applications.
Optical connectivity is the ultimate solution for high-speed data transfer. Without it, the existing copper-based interconnect technologies will reach their performance limit.
Optical connectivity is the ultimate solution for high-speed data transfer. Without it, the existing copper-based interconnect technologies will reach their performance limit.
data centers
Advanced computing
Chip-to-chip optical
connectivity
connectivity
sensors
silicon photonics connectivity for automotive, indsutrial and medical sensors
5G/6G NETWORKS
High-bandwidth
telecom applications
telecom applications
The I/O bottleneck
Data transfer is limited by copper I/Os
The connection between optics and silicon has not been reliable enough. Until now.
We have a reliable solution.
Introducing Teramount’s Universal Photonic Coupler
We developed a technology to bring the worlds of optics and semiconductors together. We can achieve 100X better tolerance when connecting a large number of optical fibers with a silicon chip compared to existing methods.
Our Technology
Seamlessly connect optics to silicon
100X BETTER TOLERANCE
Utilizes Teramount patented “self-aligning optics” for 100 times better tolerances for connecting single-mode fibers to silicon chips compared to existing coupling techniques.
ENHANCED CONNECTIVITY
Allows assembly of high fiber count for co-packaged optics and multi-fiber connectivity applications.
Manufacturing scalability
Aligns photonics with the mature semiconductor manufacturing and packaging lines for photonics mass production.
Durability
Incorporates wafer-level optical elements (Photonic-Bump) for significantly increased reliability and high-yield silicon photonics manufacturing and packaging.
Our Products
The Universal Photonic Coupler
Our Universal Photonic Coupler connects single-mode and polarization-maintaining fibers to silicon photonics chips.
It enables connectivity of a large number of fibers in co-packaged optics, transceivers, sensors and more for AI/ML processors, switches and other advanced computing applications.
Photonics can now be seamlessly integrated with electronics and our customers benefit from high volume manufacturing of high-bandwidth and low power products.
It enables connectivity of a large number of fibers in co-packaged optics, transceivers, sensors and more for AI/ML processors, switches and other advanced computing applications.
Photonics can now be seamlessly integrated with electronics and our customers benefit from high volume manufacturing of high-bandwidth and low power products.
Boost your connectivity with our Universal Photonic Coupler.
Our ProductsNews
News and innovations from Teramount
Koch Disruptive Technologies (KDT) leads Series A to accelerate Teramount's transition to high-volume production, with the participation of AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund, Wistron, Grove Ventures and others.
Hesham Taha (pictured), CEO of start-up Teramount, is more upbeat about silicon photonics than ever. But, as he outlines, challenges remain. Hesham Taha is putting in the miles. The CEO of Teramount has been travelling to the East and West to meet with companies.
“When Avi and I set up the company, we were focused on chip-to-chip optical connectivity,” recalls Dr. Taha. “At the time, people kept asking us, ‘Which customers...